It is an insulating material of high purity to seal semiconductor IC.
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Flip Chip Underfill (UF) -
Chip-on-Film Underfill (COF) -
CSP/BGA Board Level Underfill (SUF) -
Dam-and-Fill Encapsulant -
UV Light Curing Adhesives -
B-stage Adhesives -
Low-temperature
Curing Adhesive -
Die Attach Adhesives
It is an insulating material for the passive components.
The special process is given to the
thermosetting resin mainly composed of epoxy resin, and the conductive
material of the heat stiffening type of a possible cryogenic processing that
uniformly distributes the conductive powder processed by itself.
The product with various characteristics by development and the blend of the conductive powder can be manufactured.
The product with various characteristics by development and the blend of the conductive powder can be manufactured.
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Pastes for Terminal
Electrodes of Passive
Components -
Surface Mounting Adhesives -
Die Attach Adhesives -
Flip Chip Adhesive (SBB)
It is conductive paste of the baking type that
distributes metallic particle (Ag,Cu,Ni) and an inorganic additive, etc. in
the vehicle.
It is adjusted to the kind of the prime field and the paste characteristic corresponding to the processing condition and the spreading method, etc.
It is adjusted to the kind of the prime field and the paste characteristic corresponding to the processing condition and the spreading method, etc.
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Pastes for Internal
Electrodes of Passive
Components -
Pastes for Terminal
Electrodes of Passive
Components -
Pastes for Electrodes on the Back/Front of Solar Cells
It is a thin film and a high nonconductivity bonding
film that can correspond to the higher frequency, reducing the thickness,
and the miniaturization of the semiconductor and the passive components.
