Low-temperature sintered high thermally conductive die attach pastes using MO technology
Key Features
Low-temperature sintered high thermally conductive die attach pastes using MO technology
With the demand for high power electronics rapidly increasing, there is an ever growing need for high thermal conductivity adhesives that meet RoHs requirements. NAMICS has developed a pressureless, low temperature sintering silver using our MO Technology with resin reinforcement. The combination of these novel technologies results a durable die attach material with outstanding thermal conductivity of 150 W/mK and electrical conductivity as low as 8 ohm-cm. Please contact us for further information and samples.
Property Data
| Product Number |
Characteristics | Applications | Viscosity [Pa･s] |
Curing condition |
Volume resistivity [Ω･cm] |
Adhesive strength [N/mm2] |
Thermal conductivity [W/mK] |
|---|---|---|---|---|---|---|---|
| H 9890-6A | High thermal conductivity High adhesion strength |
Power IC SiC, GaN |
30 (E type 5rpm) | RT -> 200C for 60min, hold for 60min |
8×10-6 | 50 | 140 |
| H 9890-6S | High thermal conductivity High adhesion strength |
Power IC SiC, GaN |
30 (E type 5rpm) | RT -> 200C for 60min, hold for 60min |
11×10-6 | 45 | 100 |
| H 9890-6 | High thermal conductivity High adhesion strength |
Power IC SiC, GaN |
30 (E type 5rpm) | RT -> 200C for 60min, hold for 60min |
15×10-6 | 35 | 60 |
CONTACT
For inquiries or consultation regarding our products, please contact us on the following page.