Low-temperature-sintering High thermal-conductivity Die Attach Adhesives Using MO Technology (conductive, sintering type)

Key Features

Low-temperature sintered high thermally conductive die attach pastes using MO technology

Materials with higher heat-dissipation are required as device development seeks higher density and integration.
Low-temperature curable highly thermally conductive die attach materials has been developed using MO technology. Products are available including one that provides thermal conductivity of more than 200 W/mK.
Samples are available upon your request.

Property Data

Product
Number
Characteristics Applications Viscosity
[Pa・s]
Curing
Conditions
Volume
Resistivity
[Ω・cm]
Adhesive
Strength
[N/mm2]
Thermal
Conductivity
[W/mK]
H9892-5 Silver sintering material for pressure bonding
Bond to bare copper substrate
Good for temporary bonding of elements with heat
Good for printing application
Power IC
SiC、GaN
40 (E type 5rpm) Pressure: 15MPa
Temperature: 300Co
Time: 2min.
2.7×10-6 80 250
H9888-2 Silver sintering material for pressure-less bonding
High density and very high thermal conductivity type
Good for dispensing application
Power IC
SiC、GaN
35 (E type 5rpm) RT -> 210C for 62min,
hold for 60min
5×10-6 85 275
H 9890-6A Silver sintering material for pressure-less bonding
High thermal conductivity type
Good for dispensing application
Power IC
SiC、GaN
30 (E type 5rpm) RT -> 200C for 60min,
hold for 60min
8×10-6 50 140
H 9890-10A Silver sintering material for pressure-less bonding
High thermal conductivity type with low bleed-out property
Good for dispensing application
Power IC
SiC、GaN
30 (E type 5rpm) RT -> 200C for 60min,
hold for 60min
8×10-6 75 140
H 9890-11 Silver sintering material for pressure-less bonding
Thermally conductive and low modulus type
Good for dispensing application
Power IC
SiC、GaN
30 (E type 5rpm) RT -> 200C for 60min,
hold for 60min
15×10-6 35 60

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