Die Attach Adhesives (Unimec)

Die Attach Adhesives applications

Key Features

These conductive adhesives are heat-cured to accommodate various applications, including die bonding, LED bonding, lead bonding, and high thermal conductivity.

Property Data

Product
Number
Characteristics Applications Viscosity
[Pa・s]
Application
method
Curing
condition
Volume
resistivity
[Ω・cm]
Adhesive
strength
[N/mm2]
Thermal
conductivity
[W/mK]
H 9607 Applicable for all LED colors
Good adhesion
at high temperature
For LED 25 (E type2.5rpm) Dispensing
Transferring
150℃, 120min 1.5×10-4 16 10
H 9863 For Blue and White light
Good heat-resistance and
light-resistance
For LED 25 (E type2.5rpm) Transferring 160℃, 90min 1.3×10-4 11 17
H 9683 High thermal conductivity
Excellent adhesive strength
Void free
QFP, QFN 25 (E type2.5rpm) Dispensing 150℃, 60min 0.5×10-4 18 11
H 9800 Non-bleeding
Good adhesion
at high temperature
QFP, QFN 16 (E type5rpm) Dispensing 150℃, 30min 7.0×10-3 45 2
H 9940 High thermal conductivity
High reliability
QFP, QFN 30 (HBT 10rpm) Dispensing 25 -> 200C
for 30min
200℃, 15min
4.5×10-5 13 12

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