Cu Pastes for Printed Circuit of Ceramic Substrate
Key Features
A high-temperature sintering type copper paste used to form printed circuits on ceramic substrates used in power modules.
This paste can be used not only for alumina substrates, but also for aluminum nitride substrates with high thermal conductivity and excellent heat dissipation.
Property Data
| Product Number |
Characteristics | Viscosity [Pa・s} |
Resistivity [μΩ・㎝] |
Application Method |
Conditions |
|---|---|---|---|---|---|
| XK6298 | Low resistance, Good adhesion |
400 | 3.0 | Screen printong | 850～900℃ （N2 Atmosphere） |
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