Cu Pastes for Printed Circuit of Ceramic Substrate

Key Features

A high-temperature sintering type copper paste used to form printed circuits on ceramic substrates used in power modules.
This paste can be used not only for alumina substrates, but also for aluminum nitride substrates with high thermal conductivity and excellent heat dissipation.

Property Data

Product
Number
Characteristics Viscosity
[Pa・s}
Resistivity
[μΩ・㎝]
Application
Method
Conditions
XK6298 Low resistance,
Good adhesion
400 3.0 Screen printong 850~900℃
(N2 Atmosphere)

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