Cu Pastes for Printed Circuits and Thick Layer Printing for Ceramic Substrates
Key Features
A high-temperature sintering type copper paste is designed to form printed circuits on various types of ceramic substrates. The paste is also ideal for thick layer printing, which enables a thick copper layer as a replacement of copper plates on ceramic substrates used in power modules.
This paste is applicable not only for alumina substrates, but also for aluminum nitride and silicon nitride substrates with high thermal conductivity and excellent heat dissipation.
Property Data
| Product Number |
Characteristics | Viscosity [Pa・s} |
Resistivity [μΩ・㎝] |
Application Method |
Conditions |
|---|---|---|---|---|---|
| XK6298-2 | Applicable for alumina substrates and aluminum nitride substrates |
400 | 3.5 | Screen printing | 900℃ （N2 Atmosphere） |
| XK6298-3 | Applicable for silicon nitride substrates |
400 | 5.5 | Screen printing | 900℃ （N2 Atmosphere） |
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