New Products
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Pre-applied non-conductive underfill (PAM)
This is a pre-applied non-conductive underfill. It is applied to substrates or interposers and uses a thermal […]
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Dielectric Coating
Substrate:Aluminum substrate Coating thickness:1~2um Dielectric Coating Thixorion Thixorion is a registered tr […]
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Electromagnetic Interference (EMI) Shielding Paste
Key Features NAMICS has developed a sprayable conductive Ag paste for EMI shielding used with semiconductor pa […]
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Air-curable Conductive Copper Paste
Cross-sectional image of the cured copper paste Key Features Printed electronics has received increasing atten […]
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Stretchable Pastes
Vital organ sensors embedded in clothing Key Features Our stretchable pastes include (1) silver, carbon, and i […]
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