Pre-applied non-conductive underfill (PAM)

This is a pre-applied non-conductive underfill. It is applied to substrates or interposers and uses a thermal […]

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Dielectric Coating

Substrate：Aluminum substrate Coating thickness：1～2um Dielectric Coating Thixorion Thixorion is a registered tr […]

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Electromagnetic Interference (EMI) Shielding Paste

Key Features NAMICS has developed a sprayable conductive Ag paste for EMI shielding used with semiconductor pa […]

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Air-curable Conductive Copper Paste

Cross-sectional image of the cured copper paste Key Features Printed electronics has received increasing atten […]

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Stretchable Pastes

Vital organ sensors embedded in clothing Key Features Our stretchable pastes include (1) silver, carbon, and i […]

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