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Power Modules Highly Thermally Conductive TIM
Key Features Highly thermally conductive TIM, Thermal Interface Material, was newly developed. This …
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Substrates / Wirings Insulating Coatings
Substrate:Aluminum substrate Coating thickness:1-2 um Key Features Inorganic-organic hybrid nanocomp…
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Semiconductor Packages Electromagnetic Interference (EMI) Shielding Paste
Key Features NAMICS has developed a sprayable conductive Ag paste for EMI shielding used with semico…
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Substrates / Wirings Air-curable Conductive Copper Pastes
Key Features Heat curing conductive material with copper filler Excellent conductivity at air-curing…
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