Unimec: Heat-curing-type Conductive Paste
The special process is given to the thermosetting resin mainly composed of epoxy resin, and the conductive material of the heat stiffening type of a possible cryogenic processing that uniformly distributes the conductive powder processed by itself. The product with various characteristics by development and the blend of the conductive powder can be manufactured.
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Substrates / Wirings Heat-curing Low Resistance Wiring Pastes
Key Features With a specialized conductive filler in the electrode, this heat-curing wiring paste is…
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Semiconductor Packages Electromagnetic Interference (EMI) Shielding Paste
Key Features NAMICS has developed a sprayable conductive Ag paste for EMI shielding used with semico…
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Substrates / Wirings Air-curable Conductive Copper Paste
Cross-sectional image of the cured copper paste Key Features Printed electronics has received increa…
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SMT (passive components / mounting materials) Surface Mounting Adhesives
Surface Mounting Adhesives applications Key Features These are heat-cured conductive adhesives that …
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SMT (passive components / mounting materials) Pastes for Terminal Electrodes of Passive Components (UNIMEC)
Pastes for Terminal Electrodes of Passive Components applications Key Features These electro-conduct…
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Flip Chip Adhesive (SBB)
Flip Chip Adhesice applications Key Features This thermoplastic conductive adhesive is used to suppl…
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Power Modules Die Attach Adhesives (conductive, heat-curing type)
Die Attach Adhesives applications Key Features These conductive adhesives are heat-cured to accommod…
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Substrates / Wirings Heat-curing Solar Cell Surface and Back Electrode Agents (UNIMEC)
Pastes for Electrodes on the Back / Front of Solar Cells applications Key Features These electro-con…
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Power Modules Low-temperature-sintering High thermal-conductivity Die Attach Adhesives Using MO Technology (conductive, sintering type)
Key Features Low-temperature sintered high thermally conductive die attach pastes using MO technolog…
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