Unimec
The special process is given to the thermosetting resin mainly composed of epoxy resin, and the conductive material of the heat stiffening type of a possible cryogenic processing that uniformly distributes the conductive powder processed by itself. The product with various characteristics by development and the blend of the conductive powder can be manufactured.
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Electromagnetic Interference (EMI) Shielding Paste
XH9493-50 Key Features NAMICS has developed a sprayable conductive pastefor EMI shielding. The coating is cure […]
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High thermal conductivity paste (Low modulus, High reliability)
Key Features Lower stress to die, Void-free bondlines Application High reliability/Military Plastic PGA, BGA, […]
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Air-curable Conductive Copper Paste
Cross-sectional image of the cured copper paste Key Features Printed electronics has received increasing atten […]
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Stretchable Conductive Pastes
Vital organ sensors embedded in clothing Key Features NAMICS has developed stretchable low resistivity silver […]
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Surface Mounting Adhesives
Surface Mounting Adhesives applications Key Features These are heat-cured conductive adhesives that are resist […]
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Pastes for Terminal Electrodes of Passive Components (Unimec)
Pastes for Terminal Electrodes of Passive Components applications Key Features These electro-conductive pastes […]
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Flip Chip Adhesive (SBB)
Flip Chip Adhesice applications Key Features This thermoplastic conductive adhesive is used to supplement elec […]
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Die Attach Adhesives (Unimec)
Die Attach Adhesives applications Key Features These conductive adhesives are heat-cured to accommodate variou […]
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Pastes for Electrodes on the Back/Front of Solar Cells (Unimec)
Pastes for Electrodes on the Back / Front of Solar Cells applications Key Features These electro-conductive pa […]
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Low-temperature sintered high thermally conductive die attach pastes using MO technology
Key Features Low-temperature sintered high thermally conductive die attach pastes using MO technology With the […]
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