The special process is given to the thermosetting resin mainly composed of epoxy resin, and the conductive material of the heat stiffening type of a possible cryogenic processing that uniformly distributes the conductive powder processed by itself. The product with various characteristics by development and the blend of the conductive powder can be manufactured.

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  Electromagnetic Interference (EMI) Shielding Paste

  Key Features NAMICS has developed a sprayable conductive Ag paste for EMI shielding used with semiconductor pa […]

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  Air-curable Conductive Copper Paste

  Cross-sectional image of the cured copper paste Key Features Printed electronics has received increasing atten […]

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  Stretchable Pastes

  Vital organ sensors embedded in clothing Key Features Our stretchable pastes include (1) silver, carbon, and i […]

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  Surface Mounting Adhesives

  Surface Mounting Adhesives applications Key Features These are heat-cured conductive adhesives that are resist […]

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  Pastes for Terminal Electrodes of Passive Components (Unimec)

  Pastes for Terminal Electrodes of Passive Components applications Key Features These electro-conductive pastes […]

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  Flip Chip Adhesive (SBB)

  Flip Chip Adhesice applications Key Features This thermoplastic conductive adhesive is used to supplement elec […]

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  Die Attach Adhesives (Unimec)

  Die Attach Adhesives applications Key Features These conductive adhesives are heat-cured to accommodate variou […]

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  Pastes for Electrodes on the Back/Front of Solar Cells (Unimec)

  Pastes for Electrodes on the Back / Front of Solar Cells applications Key Features These electro-conductive pa […]

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  Low-temperature sintered high thermally conductive die attach pastes using MO technology

  Key Features Low-temperature sintered high thermally conductive die attach pastes using MO technology With the […]

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