Pastes for Terminal Electrodes of Passive Components (Unimec)

Pastes for Terminal Electrodes of Passive Components applications

Key Features

These electro-conductive pastes are sintered to suit specific processes, and are used for terminal electrodes of passive components for surface mounting, such as resistors, MLCCs and inductors. We are working to achieve lead-free products.

Property Data

Product
Number
Characteristics Applications Viscosity
[Pa・s]
Application
method
Curing
condition
Volume
resistivity
[Ω・cm]
Adhesive
strength
[N/mm2]
H9139 Standard The plating groundwork
of dexterous chip resistor
17 Dipping method 200℃, 30min. 2.5×10-4 17
H9135 excellent adhesive
strength
The plating groundwork
of dexterous chip resistor
35 Dipping method 200℃, 30min. 4.0×10-4 25
H9143 Low-cost The plating groundwork
of dexterous chip resistor
17 Dipping method 200℃, 30min. 4.0×10-4 12
H 9117S for print The plating groundwork
of dexterous chip resistor
60 Screen printing 200℃, 30min. 0.9×10-4 16
H9198 Soft termination MLCC roller end face
for two layers
45 Dipping method 170℃, 30min. 2.0×10-4 18
H9480 Low resistance Tantalum capacitor,
For lead frame bonding
54 Transcript 150℃, 30min. 0.4×10-4 17
H9480S Low resistance Tantalum capacitor,
For taking out electrode
22 Dipping method 150℃, 30min. 0.4×10-4 17

CONTACT

For inquiries or consultation regarding our products, please contact us on the following page.

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