Dam-and-Fill Encapsulant applications
Dam-and-Fill materials encapsulate your wire bonded device as an electrically insulating material. Dispensing a high-viscosity dam followed by a low-viscosity fill, will create a completed encapsulated package for your CSP and BGA. Dam-and-Fill materials offer high package reliability and reduced warpage.
|Modulus of Elasticity
|Chipcoat G8345D||Sharp dam shape||55||145||17.0||15||60|
|Chipcoat G8345D-37||Sharp dam shape, Fine filler||60||140||10.0||25||70|
|Chipcoat G8345-6||Low warpage, High fluidity||60||145||18.0||15||50|
|Chipcoat G8345-29||Low warpage, Fine filler||35||140||14.0||17||60|
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