Low-temperature Curable Adhesives
Low-temperature Curable Adhesives applications
Key Features
This insulating adhesive can be cured at less than 100℃, and is used for adhesions requiring high positional precision, and for bonding members that have low heat resistance.
Property Data
| Product Number | Characteristics | Applications | Viscosity [Pa･s] |
Curing condition | Tg [℃] |
|---|---|---|---|---|---|
| AH8455-345B | Curable at low-temperature | Multiple uses | 40 | 80℃, 60min. | 106 |
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