Low-temperature Curable Adhesives

Low-temperature Curable Adhesives applications

Key Features

This insulating adhesive can be cured at less than 100℃, and is used for adhesions requiring high positional precision, and for bonding members that have low heat resistance.

Property Data

Product Number Characteristics Applications Viscosity
[Pa・s]
Curing condition Tg
[℃]
AH8455-345B Curable at low-temperature Multiple uses 40 80℃, 60min. 106

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