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Chipcoat

It is an insulating material of high purity to seal semiconductor IC.

  • Chip-on-Film Underfill (COF)

    Chip-on-Film Underfill applications Key Features Chip-on-Film Underfill is used for flexible substrates as ins […]

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  • Flip Chip Underfill (UF)

    Flip Chip Underfill applications Key Features Flip Chip Underfill is an insulating material used in mounting t […]

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  • Dam-and-Fill Encapsulant

    Dam-and-Fill Encapsulant applications Key Features Dam-and-Fill materials encapsulate your wire bonded device […]

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  • CSP/BGA Board Level Underfill (SUF)

    CSP/BGA Board Level Underfill applications Key Features CSP/BGA Board Level Underfill is used for filling and […]

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  • B-stage Adhesives

    B-stage Adhesives applications Key Features These insulating adhesives can be B-staged by UV light or by heati […]

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  • Camera module adhesive

    Camera module adhesive Key Features Camera module adhesive are insulating adhesives used in processes requirin […]

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  • Die Attach Adhesive (Non-Conductive)

    Die Attach Adhesive applications Key Features Die attach adhesive is an insulator that is dispensed in a patte […]

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  • Low-temperature Curable Adhesives

    Low-temperature Curable Adhesives applications Key Features This insulating adhesive can be cured at less than […]

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    • Small but Global : To the world with technology that is Only one, Number one!
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    • The global expansion of NAMICS
    • Five growth areas the development of which NAMICS is engaged in
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