It is an insulating material of high purity to seal semiconductor IC.

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  Chip-on-Film Underfill (COF)

  Chip-on-Film Underfill applications Key Features Chip-on-Film Underfill is used for flexible substrates as ins […]

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  Flip Chip Underfill (UF)

  Flip Chip Underfill applications Key Features Flip Chip Underfill is an insulating material used in mounting t […]

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  Dam-and-Fill Encapsulant

  Dam-and-Fill Encapsulant applications Key Features Dam-and-Fill materials encapsulate your wire bonded device […]

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  CSP/BGA Board Level Underfill (SUF)

  CSP/BGA Board Level Underfill applications Key Features CSP/BGA Board Level Underfill is used for filling and […]

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  B-stage Adhesives

  B-stage Adhesives applications Key Features These insulating adhesives can be B-staged by UV light or by heati […]

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  Camera module adhesive

  Camera module adhesive Key Features Camera module adhesive are insulating adhesives used in processes requirin […]

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  Die Attach Adhesive (Non-Conductive)

  Die Attach Adhesive applications Key Features Die attach adhesive is an insulator that is dispensed in a patte […]

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  Low-temperature Curable Adhesives

  Low-temperature Curable Adhesives applications Key Features This insulating adhesive can be cured at less than […]

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  Pre-applied non-conductive underfill paste (NCP)

  Pre-applied non-conductive underfill paste (NCP) Key Features This is a pre-applied non-conductive underfill p […]

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