Chipcoat
It is an insulating material of high purity to seal semiconductor IC.
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Chip-on-Film Underfill (COF)
Chip-on-Film Underfill applications Key Features Chip-on-Film Underfill is used for flexible substrates as ins […]
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Flip Chip Underfill (UF)
Flip Chip Underfill applications Key Features Flip Chip Underfill is an insulating material used in mounting t […]
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Dam-and-Fill Encapsulant
Dam-and-Fill Encapsulant applications Key Features Dam-and-Fill materials encapsulate your wire bonded device […]
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CSP/BGA Board Level Underfill (SUF)
CSP/BGA Board Level Underfill applications Key Features CSP/BGA Board Level Underfill is used for filling and […]
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B-stage Adhesives
B-stage Adhesives applications Key Features These insulating adhesives can be B-staged by UV light or by heati […]
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Camera module adhesive
Camera module adhesive Key Features Camera module adhesive are insulating adhesives used in processes requirin […]
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Die Attach Adhesive (Non-Conductive)
Die Attach Adhesive applications Key Features Die attach adhesive is an insulator that is dispensed in a patte […]
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Low-temperature Curable Adhesives
Low-temperature Curable Adhesives applications Key Features This insulating adhesive can be cured at less than […]
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