Heat-curing Low Resistance Wiring Pastes
- With a specialized conductive filler in the electrode, this heat-curing wiring paste is designed to minimize resistance.
- Recommended Conditions for Use
Drying: 10 min at 150℃
Curing: 30 min at 200℃
|Product Number||Characteristics||Viscosity [Pa･s]||Non-volatile Content [％]||Specific Resistance Value
|H9403 Series||Low resistance, Heat-curing type||650||90-95||5.0×10-6|
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