Heat-curing Low Resistance Wiring Pastes
Key Features
- With a specialized conductive filler in the electrode, this heat-curing wiring paste is designed to minimize resistance.
- Recommended Conditions for Use
Drying: 10 min at 150℃
Curing: 30 min at 200℃
Property Data
| Product Number | Characteristics | Viscosity [Pa･s] | Non-volatile Content [％] | Specific Resistance Value [Ω･cm] |
|---|---|---|---|---|
| H9403 Series | Low resistance, Heat-curing type | 650 | 90-95 | 5.0×10-6 |
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