Heat-curing Low Resistance Wiring Pastes

Key Features

  • With a specialized conductive filler in the electrode, this heat-curing wiring paste is designed to minimize resistance.
  • Recommended Conditions for Use
    Drying: 10 min at 150℃
    Curing: 30 min at 200℃

Property Data

Product Number Characteristics Viscosity [Pa・s] Non-volatile Content [%] Specific Resistance Value
H9403 Series Low resistance, Heat-curing type 650 90-95 5.0×10-6

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