Chip-on-Film Underfill (encapsulants)

Chip-on-Film Underfill applications

Key Features

Chip-on-Film Underfill is used for flexible substrates as insulating material used in mounting technologies involving direct electrical connections between IC chips and mounting boards. Chip-on-Film Underfill has the ability to fill fine gaps and provides outstanding moisture resistance.

Related Products

CONTACT

For inquiries or consultation regarding our products, please contact us on the following page.

Inquiry