Application-specific Ag Pastes

Key Features

A paste with a high resistance to soldering heat can be used as an alternative for applications conventionally requiring AgPd or AgPt pastes, enabling a more stable price through Pd and Pt reduction.
This Ag paste, applicable for aluminum-nitride (AIN) substates, features excellent adhesion strength and solves the current challenge that a thick coating method cannot be adopted due to unsatisfied adhesion strength.
Ag paste for Via filling hardly causes any indentation due to shrinkage after curing.
Ag paste for low-resistance elements has reduced Pd content, less than 50% of conventional products.

Product Name

Product Number Characteristics Viscosity [Pa・s]
HR4501 High resistance to soldering heat, Resistance to migration Ag paste, Ag/Pd/Pt paste alternative 200
HR4441B High resistance to soldering heat, Resistance to migration Ag paste, Ag/Pt paste alternative 200
HR4535 Ag paste applicable to AIN substrates 250

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