Application-specific Ag Pastes
A paste with a high resistance to soldering heat can be used as an alternative for applications conventionally requiring AgPd or AgPt pastes, enabling a more stable price through Pd and Pt reduction.
This Ag paste, applicable for aluminum-nitride (AIN) substates, features excellent adhesion strength and solves the current challenge that a thick coating method cannot be adopted due to unsatisfied adhesion strength.
Ag paste for Via filling hardly causes any indentation due to shrinkage after curing.
Ag paste for low-resistance elements has reduced Pd content, less than 50% of conventional products.
|Product Number||Characteristics||Viscosity [Pa･s]|
|HR4501||High resistance to soldering heat, Resistance to migration Ag paste, Ag/Pd/Pt paste alternative||200|
|HR4441B||High resistance to soldering heat, Resistance to migration Ag paste, Ag/Pt paste alternative||200|
|HR4535||Ag paste applicable to AIN substrates||250|
For inquiries regarding Ag paste for via filling and low-resistance elements, please contact us from the following inquiry page.
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