Low-temperature Sintered Conductive Pastes Using MO Technology

The appearance after low temperature sintering

Key Features

As the high function of the electronic device advances, conductive paste which has low temperature cure, low resistance and high thermal conductivity are required. NAMICS own MO technology enables to sinter Ag at low temperature 150 degree and also get low resistance and high thermal conductivity. This MO technology can meet customer’s various requirements.


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