Air-curable Conductive Copper Pastes

Cross-sectional image of the cured copper paste

Key Features

Printed electronics has received increasing attention in recent years as a promising technology for the next generation of IoT. Compared with photolithography, it not only enables circuit fabrication on flexible substrates, but also cost reduction through the elimination of some processes such as exposure and etching.

Conductive paste is a key material for this technology. Currently silver is the most commonly used filler for conductive pastes due to its high conductivity and stability. However, silver has some concerns such as price volatility and ionic migration. Therefore, copper is expected to an acceptable alternative material because of its significant advantage in cost and higher resistance to migration while providing the same level of conductivity as silver.

NAMICS is developing conductive copper pastes which have high conductivity with 200 deg C curing. Even as development is continuing, we can provide evaluation samples of the three types of copper pastes shown below.


  • Air-curable Cu Paste
    ①XCH9207 High-Conductivity
  • N2-curable Cu Paste
    ②XCH9213 Excellent Conductivity and Printing Performance

Property Data

  Filler Diameter[μm] Printing Performance Conductivity(Air-curing) Conductivity(N2-curing)
XCH9207 5 Good Excellent Good
XCH9213 1 Excellent Poor Excellent

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