Corner / Edge Bonding Pastes
Namics’ board-level corner/edge bonding materials come in reworkable or non-reworkable types with excellent workability and securely reinforce each corner of a semiconductor package. Not requiring a package underfill process, the product allows you higher UPH, cost reduction, and higher reliability. With its high thixotropy properties, the product allows for targeted application only in areas where it is needed.
|Product Number||Characteristics||Viscosity [Pa･s]||Thixotropy||Tg［℃］||Modulus
|SUF1583-19||Low Tg, Reworkable||40||3||80||7||37||130|
|XSUF1583-28||High TG, Non-reworkable, High reliability||80||3||130||8||33||100|
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