Low Modulus Thermal Conductive Film for Metal Base Substrate
Suitable for applications that require heat dissipation, such as power module, and automotive components. It has the capability of adhering on irregular surfaces because it becomes flexible when heated.
|TC1203||Low thermal resistance||3||60||260℃||50|
|TC1211||Low thermal resistance
High heat resistance
|TC1215||High heat resistance
Solder crack resistance
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