Non conductive film with high thermal conductivity
Key Features
Non conductive film is suitable for heat sink and porwer module. It has the capability of adhering on irregular surfaces because it becomes flexible when heated.
Property Data
| Product Number |
Characteristics | Thermal conductivity [W/mK] |
Cu peel Strength [N/cm] |
Insulating Disruptive Voltage [AC KV/mm] |
Thermal Resistance (TG5% decrease) [℃] |
|---|---|---|---|---|---|
| TC1203 | High thermal conductivity, High breakdown voltage, High adhesion strength |
3 | 8 | 60 | 370 |
CONTACT
For inquiries or consultation regarding our products, please contact us on the following page.