Non conductive film with high thermal conductivity

Key Features

Non conductive film is suitable for heat sink and porwer module. It has the capability of adhering on irregular surfaces because it becomes flexible when heated.

Property Data

Product
Number
Characteristics Film
Thickness
Recommended
Curing
Condition
Thermal
conductivity
[W/mK]
Cu peel
Strength
[N/cm]
Insulating
Disruptive
Voltage
[AC KV/mm]
Thermal
Resistance
(TG5%
decrease)
[℃]
TC1203 High thermal conductivity in thin film
High breakdown voltage
High adhesion strength
80µm 180℃, 120min
1MPa
3 8 60 370

Please contact the local sales if you wish other thickness.

CONTACT

For inquiries or consultation regarding our products, please contact us on the following page.

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