Non conductive film with high thermal conductivity

Key Features
Non conductive film is suitable for heat sink and porwer module. It has the capability of adhering on irregular surfaces because it becomes flexible when heated.
Property Data
Product Number |
Characteristics | Thermal conductivity [W/mK] |
Cu peel Strength [N/cm] |
Insulating Disruptive Voltage [AC KV/mm] |
Thermal Resistance (TG5% decrease) [℃] |
---|---|---|---|---|---|
TC1203 | High thermal conductivity, High breakdown voltage, High adhesion strength |
3 | 8 | 60 | 370 |
CONTACT
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