High Thermal-conductivity Films (insulating type)
Key Features
Suitable for applications that require heat dissipation, such as power module, and automotive components. It has the capability of adhering on irregular surfaces because it becomes flexible when heated.
Property Data
| Product Number |
Characteristics | Thermal conductivity [W/mK] |
Cu peel Strength [N/cm] |
Insulating Disruptive Voltage [AC KV/mm] |
Thermal Resistance (TG5% decrease) [℃] |
|---|---|---|---|---|---|
| TC1203 | High thermal conductivity, High breakdown voltage, High adhesion strength |
3 | 8 | 60 | 370 |
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