Non conductive film with high thermal conductivity
Key Features
Non conductive film is suitable for heat sink and porwer module. It has the capability of adhering on irregular surfaces because it becomes flexible when heated.
Property Data
| Product Number |
Characteristics | Film Thickness |
Recommended Curing Condition |
Thermal conductivity [W/mK] |
Cu peel Strength [N/cm] |
Insulating Disruptive Voltage [AC KV/mm] |
Thermal Resistance (TG5% decrease) [℃] |
|---|---|---|---|---|---|---|---|
| TC1203 | High thermal conductivity in thin film High breakdown voltage High adhesion strength |
80µm | 180℃, 120min 1MPa |
3 | 8 | 60 | 370 |
Please contact the local sales if you wish other thickness.
CONTACT
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