Non conductive film with high thermal conductivity

Key Features

Non conductive film is suitable for heat sink and porwer module. It has the capability of adhering on irregular surfaces because it becomes flexible when heated.

Property Data

Product
Number
Characteristics Thermal
conductivity
[W/mK]
Cu peel
Strength
[N/cm]
Insulating
Disruptive
Voltage
[AC KV/mm]
Thermal
Resistance
(TG5%
decrease)
[℃]
TC1203 High thermal conductivity,
High breakdown voltage,
High adhesion strength
3 8 60 370

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