Insulating adhesive film for high frequency, high speed transmission flexible (FPC) and rigid electronic circuit substrates
Insulating adhesive film for high frequency, high speed transmission flexible (FPC) and rigid electronic circuit substrates
Key Features
This is an unreacted thermosetting resin film which provides high adhesion and high heat resistance. This insulating thin film is available in thicknesses of 5-30µm. It has a low dielectric constant and a low dissipation factor in GHz frequency range. It has excellent fluidity which allows it to adapt to the concavity or convexity of surfaces under low temperature and low pressure. It has multiple uses, such as MEMS and processing materials, interlayer dielectric film, and buildup material. Laser and plating processes are also available.
Property Data
| Product Number |
Characteristics | Film Thickness |
Recom- mended Curing Condition |
εｒ | tanδ | Cu peel Strength [N/cm] |
Tg [℃] |
Elastic Modulus [GPa] |
C.T.E. α1 [ppm/℃] |
Thermal Resistance (TG5% decrease) |
Insulating Disruptive Voltage |
|---|---|---|---|---|---|---|---|---|---|---|---|
| NC0201 | High reliability (Low water absorption, high purity), High adhesion strength |
5-30, 50µm |
200℃, 60min 1MPa |
2.5 | 0.0025 | 11 | 185 | 0.8 | 130 | 370 | Equivalent with HB |
| NC0204 | High Tg, Low elastic modulus, High adhesion strength Low dielectric loss |
25µm | 200℃, 60min 1MPa |
2.4 | 0.0030 | 7 | 235 | 0.3 | 130 | 350 | Equivalent with HB |
| NC0207 | High Tg, Low elastic modulus High adhesion strength, Low dielectric loss |
25µm | 200℃, 60min 1MPa |
2.4 | 0.0027 | 7 | 230 | 0.3 | 130 | 350 | Equivalent with HB |
| NC0209 | High Tg, Low modulus, HIgh adhesion strength, Ultra-low loss modulus |
25µm | 200℃, 60min 1MPa |
2.4 | 0.0017 | 8 | 200 | 0.3 | 120 | - | - |
Please contact the local sales if you wish other thickness.
CONTACT
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