Circuit Board Bonding Sheets (insulating type)
Insulating adhesive film for high frequency, high speed transmission flexible (FPC) and rigid electronic circuit substrates
Key Features
This unreacted thermosetting resin film has low dielectric contact and low dielectric loss tangent properties, ensures good filling into rough surfaces at low temperature and low pressure, and provides high adhesion and high heat resistance. The film is applicable as an interlayer insulating material for FPC and rigid substrates and is suitable for laser processing and plating processing.
Property Data
| Product Number |
Characteristics | εｒ | tanδ | Tg [℃] |
Elastic Modulus [GPa] |
C.T.E. [ppm/℃] |
|---|---|---|---|---|---|---|
| NC0201 | Low dielectric loss, Low water absorption |
2.5 | 0.0025 | 185 | 0.8 | 130 |
| NC0207 | Low dielectric loss, High Tg, Low Elastic Modulus |
2.4 | 0.0027 | 230 | 0.3 | 130 |
CONTACT
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