Insulating adhesive film for high frequency, high speed transmission flexible (FPC) and rigid electronic circuit substrates

Insulating adhesive film for high frequency, high speed transmission flexible (FPC) and rigid electronic circuit substrates

Key Features

This unreacted thermosetting resin film has low dielectric contact and low dielectric loss tangent properties, ensures good filling into rough surfaces at low temperature and low pressure, and provides high adhesion and high heat resistance. The film is applicable as an interlayer insulating material for FPC and rigid substrates and is suitable for laser processing and plating processing.

Property Data

Product
Number
Characteristics εr tanδ Tg
[℃]
Elastic
Modulus
[GPa]
C.T.E.
[ppm/℃]
NC0201 Low dielectric loss,
Low water absorption
2.5 0.0025 185 0.8 130
NC0207 Low dielectric loss,
High Tg,
Low Elastic Modulus
2.4 0.0027 230 0.3 130

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