Low-dielectric adhesive film for high-frequency substrates
Insulating adhesive film for high frequency/high speed transmission FPC/rigid circuit bord
Features
Low dielectric constant (Dk) and low dielectric dissipation factor (Df) film achieve the decrease of the transmission loss at high frequency communication.
Applicable as an adhesive layer for PTFE multilayer substrates for high frequency applications.
Property Data
| Product Number |
Characteristics | εｒ | tanδ | Tg [℃] |
C.T.E. [ppm/℃] |
|---|---|---|---|---|---|
| NC0201 | Low Dk High Tg |
2.5 | 0.0025 | 185 | 130 |
| XNC0312 | Low Df High Tg Low CTE |
3.1 | 0.0016 | 226 | 30 |
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