Electromagnetic Interference (EMI) Shielding Paste
NAMICS has developed a sprayable conductive Ag paste for EMI shielding used with semiconductor packages. The paste provides a high shielding effect over 50 dB with a 10 um or less film thickness at 150 ℃/ 60 minutes curing. It also provides a uniform coated surface by optimizing spray conditions. The paste has a long work life without utilizing a stirring device and excellent workability. Samples are available upon request.
|T.I.(5 rpm/50 rpm)||–||3.0|
|Curing condition||–||150℃/60 min|
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