Electromagnetic Interference (EMI) Shielding Paste

Key Features

NAMICS has developed a sprayable conductive Ag paste for EMI shielding used with semiconductor packages. The paste provides a high shielding effect over 50 dB with a 10 um or less film thickness at 150 ℃/ 60 minutes curing. It also provides a uniform coated surface by optimizing spray conditions. The paste has a long work life without utilizing a stirring device and excellent workability. Samples are available upon request.

Cross-section View

Property Data

		Spray Paste
Filler	–	Ag
Resin	–	Thermosetting resin
Viscosity (10 rpm)	mPa・s	450
T.I. (5 rpm/50 rpm)	–	3.0
Curing Conditions	–	150℃/60 min
Specific Resistance	Ω・cm	4.0×10^-5
Adhesive Strength (ASTM D3559)	–	4B
Shielding Effect	dB	50