Semiconductor Packages
A range of encapsulating materials and electromagnetic wave shielding materials is available for semiconductor packages.
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Semiconductor Packages High Thermal-conductivity Underfills (encapsulants)
This product maintains the primary performance of underfill, such as flowability and insulation, whi…
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Semiconductor Packages Corner / Edge Bonding Pastes
Key Features Namics’ board-level corner/edge bonding materials come in reworkable or non-reworkable …
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Semiconductor Packages Electromagnetic Interference (EMI) Shielding Paste
Key Features NAMICS has developed a sprayable conductive Ag paste for EMI shielding used with semico…
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Semiconductor Packages Chip-on-Film Underfills (encapsulants)
Chip-on-Film Underfill applications Key Features Chip-on-Film Underfill is used for flexible substra…
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Semiconductor Packages Flip Chip Underfills (encapsulants)
Flip Chip Underfill applications Key Features Flip Chip Underfill is an insulating material used in …
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Semiconductor Packages Dam-and-Fill Encapsulants
Dam-and-Fill Encapsulant applications Key Features Dam-and-Fill materials encapsulate your wire bond…
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Semiconductor Packages CSP/BGA Board Level Underfills (encapsulants)
CSP/BGA Board Level Underfill applications Key Features CSP/BGA Board Level Underfill is used for fi…
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