It is conductive paste of the baking type that distributes metallic particle (Ag,Cu,Ni) and an inorganic additive, etc. in the vehicle. It is adjusted to the kind of the prime field and the paste characteristic corresponding to the processing condition and the spreading method, etc.

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  SMT (passive components / mounting materials) Application-specific Ag Pastes

  Key Features A paste with a high resistance to soldering heat can be used as an alternative for appl…

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  Substrates / Wirings Cu Pastes for Printed Circuits and Thick Layer Printing for Ceramic Substrates

  Key Features A high-temperature sintering type copper paste is designed to form printed circuits on …

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  SMT (passive components / mounting materials) Sintering-type Pastes for Terminal Electrodes of Passive Components (HIMEC)

  Pastes for Terminal Electrodes of Passive Components applications Key Features These electro-conduct…

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  SMT (passive components / mounting materials) Sintering-type Pastes for Internal Electrodes of Passive Components (HIMEC)

  Pastes for Internal Electrodes of Passive Components Key Features These electro-conductive pastes ar…

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