We will exhibit our products at 25th IC＆Sensor Packaging Technology EXPO 2024.

http://www.nepconjapan.jp/en/About/ICP/
We are looking forward to seeing you.

■Outline

Exhibition Period： Wednesday, January 24 – Friday, January 26, 2024, 10:00 a.m. to 5:00 p.m.

Venue： East Exhibition Hall, Tokyo Big Sight, Japan

Address:3-11-1, Ariake, Koto-ku, Tokyo, Japan 135-0063

Booth：E31-1