We will exhibit our products at 24th IC＆Sensor Packaging Technology EXPO 2023.

http://www.nepconjapan.jp/en/About/ICP/
We are looking forward to seeing you.

■Outline

Exhibition Period：Wednesday, January 25 – Friday, January 27, 2023, 10:00 a.m. to 5:00 p.m.

Venue：East Exhibition Hall, Tokyo Big Sight, Japan

Address:3-11-1, Ariake, Koto-ku, Tokyo,  Japan 135-0063

Booth：25-1