We will exhibit our products at 21th IC＆Sensor Packaging Technology EXPO 2020.

http://www.nepconjapan.jp/en/About/ICP/
We are looking forward to seeing you.

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■Outline

Exhibition Period：Wednesday, January 15 – Friday, January 17, 2020, 10:00 a.m. to 6:00 p.m.(Last day until 17:00)

Venue：West Exhibition Hall 1F, Tokyo Big Sight, Japan

Address:3-11-1, Ariake, Koto-ku, Tokyo,  Japan 135-0063

Booth：W9-11

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■Exhibition products

1. Low Temperature Curable/Dryable Low Modulus Conductive Adhesive
2. EMI Shielding pastes
3. CuTAP® – Cu Treatment Adhesion Promoter-
4. ADFLEMA Insulating Adhesive Film for High FrequencyInsulating Adhesive Film for High Frequency
5. ADFLEMA Low Modulus Thermal Conductive Film for Metal Base SubstrateLow Modulus Thermal Conductive Film for Metal Base Substrate
6. Introduction of high performance adhesive
7. Encapsulation with high heat resistance resin for next-generation
8. Capillary Underfill Material for harsh condition
9. Low resistance paste