We will exhibit our products at the 27th IC & Sensor Packaging Technology EXPO 2026.
We are looking forward to seeing you.

http://www.nepconjapan.jp/en/About/ICP/

■Outline

Exhibition Period: Wednesday, January 21 – Friday, January 23, 2026, 10:00 a.m. – 5:00 p.m.

Venue: East Exhibition Hall, Tokyo Big Sight, Japan

Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063, Japan

Booth: E31-28