Product

Unimec

Low-temperature sintered high thermally conductive die attach pastes using MO technology

With the demand for high power electronics rapidly increasing, there is an ever growing need for high thermal conductivity adhesives that meet RoHs requirements. NAMICS has developed a pressureless, low temperature sintering silver using our MO Technology with resin reinforcement. The combination of these novel technologies results a durable die attach material with outstanding thermal conductivity of 150 W/mK and electrical conductivity as low as 8 ohm-cm. Please contact us for further information and samples.

Low-temperature sintered high thermally conductive die attach pastes using MO technology
Product
Number
Characteristics Applications Viscosity
[Pa・s]
Curing
condition
Volume
resistivity
[Ω・cm]
Adhesive
strength
[N/mm2]
Thermal
conductivity
[W/mK]
H 9890-6A High thermal conductivity
High adhesion strength
Power IC
SiC, GaN
30 (E type 5rpm) RT -> 200C for 60min,
hold for 60min
8×10-6 50 140
H 9890-6S High thermal conductivity
High adhesion strength
Power IC
SiC, GaN
30 (E type 5rpm) RT -> 200C for 60min,
hold for 60min
11×10-6 45 100
H 9890-6 High thermal conductivity
High adhesion strength
Power IC
SiC, GaN
30 (E type 5rpm) RT -> 200C for 60min,
hold for 60min
15×10-6 35 60