Product

Chipcoat

CSP/BGA Board Level Underfill (SUF)

CSP/BGA Board Level Underfill is used for filling and sealing spaces by capillary action when doing secondary mounting of Packaged Chips to a Motherboard. CSP/BGA Board Level Underfill material improves thermal cycle performance and enhances impact resistance (drop-test qualification).

CSP/BGA Board Level Underfill applications
Product Number Characteristics Viscosity
[Pa・s]
Tg
[℃]
Modulus of elasticity
[GPa]
C.T.E ≦Tg
[ppm]
C.T.E ≧Tg
[ppm]
SUF 1589-1 High reliability, high throughput 10.0 120 13.0 23 80
SUF 1570-2 High reliability, high throughput 40.0 135 8.0 32 100
XSUF 1594-2 Repairable, hight throughput 0.75 105 5.5 50 160