Product

Unimec

Die Attach Adhesives

These conductive adhesives are heat-cured to accommodate various applications, including die bonding, LED bonding, lead bonding, and high thermal conductivity.

Die Attach Adhesives applications
Product
Number
Characteristics Applications Viscosity
[Pa₯s]
Application
method
Curing
condition
Volume
resistivity
[Ω₯cm]
Adhesive
strength
[N/mm2]
H 9607 Applicable for all LED colors
Good adhesion at high temperature
For LED 25 (E type2.5rpm) Transferring 150Ž, 120min 1.5~10-4 16
H 9863 For Blue and White light
Good heat-resistance and
light-resistance
For LED 25 (E type2.5rpm) Transferring 160Ž, 90min 1.3~10-4 11
H 9683 High thermal conductivity
Excellent adhesive strength
Void free
QFP, QFN 25 (E type2.5rpm) Dispensing 150Ž, 60min 0.5~10-4 18
H 9800 Non-bleeding
Good adhesion at high temperature
QFP, QFN 16 (E type5rpm) Dispensing 150Ž, 30min 7.0~10-3 45
H 9870 Non-bleeding
Low modulus
QFP, QFN 16 (E type5rpm) Dispensing 150Ž, 30min 3.0~10-3 15
Sk70N High thermal conductivity
High reliability
QFP, QFN 29 (HBT 10rpm) Dispensing 25 -> 200C
for 30min
200Ž, 15min
1.6~10-5 15
H 9940 High thermal conductivity
High reliability
QFP, QFN 30 (HBT 10rpm) Dispensing 25 -> 200C
for 30min
200Ž, 15min
4.5~10-5 13