Product

Chipcoat

Flip Chip Underfill (UF)

Flip Chip Underfill is an insulating material used in mounting technologies involving direct electrical connections. Underfill flows by capillary action into the gap between an IC chip circuit with conductive bumps and a mounting board by capillary action.

Namics has developed an extensive lineup of products in response to the demands towards of flip chip packaging. Some typical applications include CPU, LSI, and Graphic Devices. Custom formulated materials are also available for user specific applications.

Flip Chip Underfill applications
Product
Number
Characteristics Viscosity
[Pa・s]
Tg
[℃]
Modulus of
elasticity
[GPa]
C.T.E ≦Tg
[ppm]
U8443-14 Low viscosity; for tight spaces 10 135 6.5 42
U8410-73C For low K, Pb-free bumps
and tight spaces
50 88 11.5 31
U8410-73CF3 For low-K, Cu-pillar and Pb-free bumps
and tight spaces
33 88 8.8 31
U8410-99 For low-K, Pb-free bumps 50 100 11 29
U8410-302 For low-K, Cu-pillar
and Pb-free bumps
55 95 12 22
U8410-314 Low viscosity; for tight spaces 15 128 8.3 30
U8439-1 For low K and large ICs 60 70 8 36
U8439-105 For low K, large ICs and tight spaces 55 70 8.5 34