Dam-and-Fill Encapsulants
Dam-and-Fill Encapsulant applications
Key Features
Dam-and-Fill materials encapsulate your wire bonded device as an electrically insulating material. Dispensing a high-viscosity dam followed by a low-viscosity fill, will create a completed encapsulated package for your CSP and BGA. Dam-and-Fill materials offer high package reliability and reduced warpage.
Property Data
| Product Number | Characteristics | Viscosity [Pa･s] |
Tg [℃] |
Modulus of Elasticity [GPa] |
C.T.E ≦Tg [ppm] |
C.T.E ≧Tg [ppm] |
|---|---|---|---|---|---|---|
| Chipcoat G8345D | Sharp dam shape | 55 | 145 | 17.0 | 15 | 60 |
| Chipcoat G8345D-37 | Sharp dam shape, Fine filler | 60 | 140 | 10.0 | 25 | 70 |
| Chipcoat G8345-6 | Low warpage, High fluidity | 60 | 145 | 18.0 | 15 | 50 |
| Chipcoat G8345-29 | Low warpage, Fine filler | 35 | 140 | 14.0 | 17 | 60 |
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CONTACT
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