Product

ADFLEMA

Insulating adhesive film for high frequency, high speed transmission flexible (FPC) and rigid electronic circuit substrates

This is an unreacted thermosetting resin film which provides high adhesion and high heat resistance. This insulating thin film is available in thicknesses of 5-30µm. It has a low dielectric constant and a low dissipation factor in GHz frequency range. It has excellent fluidity which allows it to adapt to the concavity or convexity of surfaces under low temperature and low pressure. It has multiple uses, such as MEMS and processing materials, interlayer dielectric film, and buildup material. Laser and plating processes are also available.

Insulating adhesive film for high frequency, high speed transmission flexible (FPC) and rigid electronic circuit substrates
Product
Number
Characteristics Film
Thickness
Recom-
mended
Curing
Condition
εr tanδ Cu peel
Strength
[N/cm]
Tg
[℃]
Elastic
Modulus
[GPa]
C.T.E.
α1
[ppm/℃]
Thermal
Resistance
(TG5%
decrease)
Insulating
Disruptive
Voltage
NC0201 High reliability (Low
water absorption,
high purity), High
adhesion strength
5-30,
50µm
200℃,
60min
1MPa
2.5 0.0025 11 185 0.8
130 370 Equivalent
with HB
NC0204 High Tg, Low elastic
modulus, High
adhesion strength
Low dielectric loss
25µm 200℃,
60min
1MPa
2.4 0.0030 7 235 0.3 130 350 Equivalent
with HB
NC0207 High Tg, Low elastic
modulus High
adhesion strength,
Low dielectric loss
25µm 200℃,
60min
1MPa
2.4 0.0027 7 230 0.3 130 350 Equivalent
with HB
NC0209 High Tg, Low modulus,
HIgh adhesion strength,
Ultra-low loss modulus
25µm 200℃,
60min
1MPa
2.4 0.0017 8 200 0.3 120 - -

Please contact the local sales if you wish other thickness.