Product

Insulating Adhesives

Insulating adhesives are used when joining two or more members that do not require electrical conductivity between them for assembling and mounting electronic components.

Camera module adhesive

UV light curing adhesives are insulating adhesives used in processes requiring a minimum of shrinkage due to curing by UV light. These adhesives are used for adhesions requiring high positional precision, and for bonding members that have low heat resistance.

B-stage Adhesives

These insulating adhesives can be B-staged by UV light or by heating at 100 C for 20 minutes-curing methods which provide high adhesion-and can be applied by dispensing or printing.

Low-temperature Curable Adhesives

This insulating adhesive can be cured at less than 100 C, and is used for adhesions requiring high positional precision, and for bonding members that have low heat resistance.

Die Attach Adhesive

Die attach adhesive is an insulator that is dispensed in a pattern, and is used to bond the opposite side of the circuit on an IC chip, which has conductive bumps, to a mounting substrate.

Insulating Resin Film for Electronic Component and Module Adhesion

This is an unreacted thermosetting resin film which provides high adhesion, high heat resistance and high reliability. This insulating thin film is available in thicknesses of 5-30µm. It has a low dielectric constant and a low dissipation factor in GHz frequency range. It has excellent fluidity which allows it to adapt to the concavity or convexity of surfaces under low temperature and low pressure. It is useful for reducing the size and lowering the profile of electronic components for RF modules.

Non-Conductive Film (NCF) for Semiconductor Encapsulant

This is a pre-applied non-conductive thin adhesive film which encapsulates IC chips on semiconductor packages. This NCF contains fillers which are suitable for narrow pitch bumps, such as Cu-pillar.

Adhesive Film (For machines and measuring devices)

This is an unreacted thermosetting resin film which controls fluidity with thermal-fusion time and thermal-cure time. This insulating thin film can be very precisely applied to various types of materials and forms.