Product

Chipcoat

Camera module adhesive

Camera module adhesive are insulating adhesives used in processes requiring a minimum of shrinkage due to curing by UV light. These adhesives are used for adhesions requiring high positional precision, and for bonding members that have low heat resistance.

UV-curable Adhesive applications
Product Number Characteristics Applications Viscosity
[Pa・s]
Thixotropic index Curing condition Tg
[℃]
UV COAT 6919 UV + thermal cure,
Curable at low-temperature,
High reliability
Holder adhesive 60 5 2000mJ/cm2 + 80℃, 60min. 130