Pre-applied non-conductive underfill paste (NCP)

Pre-applied non-conductive underfill paste (NCP)

Key Features

This is a pre-applied non-conductive underfill paste. It is applied to substrates or interposers and uses a thermal compression bonding process (TCB) to encapsulate IC chips on semiconductor packages.
It has excellent productivity and can form a minimum fillet allowing a small Keep Out Zone (KOZ).

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