Insulating adhesive film for sealing semiconductor components

Insulating adhesive film for sealing semiconductor components

Key Features

This is a pre-applied non-conductive thin film adhesive. It is laminated to substrates or interposers and uses a thermal compression bonding process (TCB) to encapsulate IC chips on semiconductor packages. It has excellent productivity and can form a minimum fillet allowing a small Keep Out Zone (KOZ).
It can also be applied directly to silicon chips.

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