Pre-applied non-conductive underfill (PAM)
This is a pre-applied non-conductive underfill. It is applied to substrates or interposers and uses a thermal compression bonding process (TCB) to encapsulate IC chips on semiconductor packages.
It has excellent productivity and can form a minimum fillet allowing a small Keep Out Zone (KOZ).
Liquid type and film type are available. Film type can be applied to silicon die as well as substrate.
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