Solvent removable film for MEMS

Key Features

A material for MEMS processing. It is disolvable after curing and can be removed without physical stress.

Property Data

Product
Number
Characteristics Film
Thickness
Recommended
Curing
Condition
Cu peel
Strength
[N/cm]
Elastic
Modulus
[GPa]
solution Thermal
Resistance
(TG5%
decrease)
[℃]
PA0101 Dissolvable 32µm 160℃,60min
0.5MPa
< 2.0 1.5 MEK, acetone 300

Please contact the local sales if you wish other thickness.

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