Solvent removable film for MEMS
Key Features
A material for MEMS processing. It is disolvable after curing and can be removed without physical stress.
Property Data
| Product Number |
Characteristics | Film Thickness |
Recommended Curing Condition |
Cu peel Strength [N/cm] |
Elastic Modulus [GPa] |
solution | Thermal Resistance (TG5% decrease) [℃] |
|---|---|---|---|---|---|---|---|
| PA0101 | Dissolvable | 32µm | 160℃,60min 0.5MPa |
< 2.0 | 1.5 | MEK, acetone | 300 |
Please contact the local sales if you wish other thickness.
CONTACT
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