High thermal conductivity paste (Low modulus, High reliability)

Key Features

  • Lower stress to die, Void-free bondlines

Application

  • High reliability/Military
  • Plastic PGA, BGA, Chip-on-Board

Description

XH9940

  • High-power IC die attach

Typical properties

Product Number Thermal conductivity Modulus of elasticity Viscosity Curing condition Volume resistivity
XH9940 10 W/m°K 4,100MPa 25,000 cP 175℃30min 32μΩcm

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