High functionality insulating adhesive film for electronic parts and modules

High functionality insulating adhesive film for electronic parts and modules

Key Features

This unreacted thermosetting resin film provides high adhesion, high heat resistance, and high reliability.
The film is applicable to electronic components for RF modules which call for a smaller and thinner profiles.

Property Data

Product
Number
Characteristics Cu peel
Strength
[N/cm]
Tg
[℃]
Elastic
Modulus
[GPa]
C.T.E.
[ppm/℃]
NC0206 High reliability
(Low water absorption, High purity),
High adhesion strength
11 170 1 130

CONTACT

For inquiries or consultation regarding our products, please contact us on the following page.

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