High functionality insulating adhesive film for electronic parts and modules
High functionality insulating adhesive film for electronic parts and modules
Key Features
This is an unreacted thermosetting resin film which provides high adhesion, high heat resistance and high reliability. This insulating thin film is available in thicknesses of 5-30µm. It has a low dielectric constant and a low dissipation factor in GHz frequency range. It has excellent fluidity which allows it to adapt to the concavity or convexity of surfaces under low temperature and low pressure. It is useful for reducing the size and lowering the profile of electronic components for RF modules.
Property Data
| Product Number |
Characteristics | Film Thickness |
Cure Condition |
εｒ | tanδ | Cu peel Strength [N/cm] |
Tg [℃] |
Elastic Modulus [GPa] |
C.T.E. α1 [ppm/℃] |
Thermal Resistance (TG5% decrease) |
Insulating Disruptive Voltage |
|---|---|---|---|---|---|---|---|---|---|---|---|
| NC0201 | High reliability (Low water absorption, high purity), High adhesion strength |
5-30, 50µm |
200℃, 60min 1MPa |
2.5 | 0.0025 | 11 | 185 | 0.8 | 130 | 370 | Equivalent with HB |
| NC0204 | High Tg,Low elastic modulus High adhesion strength, Low dielectric loss |
25µm | 200℃, 60min 1MPa |
2.4 | 0.0030 | 7 | 235 | 0.3 | 130 | 350 | Equivalent with HB |
| NC0206 | High reliability (Low water absorption, high purity)、 High adhesion strength |
30µm | 180℃, 60min 1MPa |
2.5 | 0.0035 | 11 | 170 | 1.0 | 130 | 350 | Equivalent with HB |
| NC0207 | High Tg, Low elastic modulus High adhesion strength, Low dielectric loss |
25µm | 200℃, 60min 1MPa |
2.4 | 0.0027 | 7 | 230 | 0.3 | 130 | 350 | Equivalent with HB |
CONTACT
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