Advanced Functionality Insulating Adhesive Films for Electronic Components and Modules
High functionality insulating adhesive film for electronic parts and modules
Key Features
This unreacted thermosetting resin film provides high adhesion, high heat resistance, and high reliability.
The film is applicable to electronic components for RF modules which call for a smaller and thinner profiles.
Property Data
| Product Number |
Characteristics | Cu peel Strength [N/cm] |
Tg [℃] |
Elastic Modulus [GPa] |
C.T.E. [ppm/℃] |
|---|---|---|---|---|---|
| NC0206 | High reliability (Low water absorption, High purity), High adhesion strength |
11 | 170 | 1 | 130 |
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CONTACT
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