Die Attach Adhesive (Non-Conductive)

Die Attach Adhesive applications

Key Features

Die attach adhesive is an insulator that is dispensed in a pattern, and is used to bond the opposite side of the circuit on an IC chip, which has conductive bumps, to a mounting substrate.

Property Data

Product Number Characteristics Applications Viscosity
[Pa・s]
Curing condition Tg
[℃]
DA 8488-7 High thermal conductivity, Dispensing Die attach BGA package 14 ramp up to 150℃ for 30 min
+ hold for 30min
40
DA 8472-1 High thermal conductivity
for white LED
Die attach for LED 15 160℃, 60min 90

CONTACT

For inquiries or consultation regarding our products, please contact us on the following page.

Inquiry