Die Attach Adhesive (Chipcoat)
Die Attach Adhesive applications
Die attach adhesive is an insulator that is dispensed in a pattern, and is used to bond the opposite side of the circuit on an IC chip, which has conductive bumps, to a mounting substrate.
|DA 8483||Printable, B-Stage type||Die attach for DRAM package||55||B-stage: 130℃, 40min
Final cure: 175℃, 2h
|DA 8481-13||Dispensing||Die attach for BGA package||12||ramp up to 150℃ for 30 min
+ hold for 30min
|DA 8488-7||High thermal conductivity, Dispensing||Die attach BGA package||14||40|
|DA 8472-1||High thermal conductivity
for white LED
|Die attach for LED||15||160℃, 60min||90|
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