Die Attach Adhesive (Chipcoat)
Die Attach Adhesive applications
Key Features
Die attach adhesive is an insulator that is dispensed in a pattern, and is used to bond the opposite side of the circuit on an IC chip, which has conductive bumps, to a mounting substrate.
Property Data
| Product Number | Characteristics | Applications | Viscosity [Pa･s] |
Curing condition | Tg [℃] |
|---|---|---|---|---|---|
| DA 8483 | Printable, B-Stage type | Die attach for DRAM package | 55 | B-stage: 130℃, 40min Final cure: 175℃, 2h |
67 |
| DA 8481-13 | Dispensing | Die attach for BGA package | 12 | ramp up to 150℃ for 30 min + hold for 30min |
65 |
| DA 8488-7 | High thermal conductivity, Dispensing | Die attach BGA package | 14 | 40 | |
| DA 8472-1 | High thermal conductivity for white LED |
Die attach for LED | 15 | 160℃, 60min | 90 |
CONTACT
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