The NAMICS North American R&D Center - Diemat, Inc.@Profile

High thermal conductivity paste

Low modulus, High reliability

KEY FEATURES

  • Lower stress to die, Void-free bondlines

APPLICATION

  • High reliability/Military
  • Plastic PGA, BGA, Chip-on-Board

DESCRIPTION

XH9940

  • High-power IC die attach

Typical properties

Product Number Thermal conductivity Modulus of elasticity Viscosity Curing condition Volume resistivity
XH9940 10 W/mK 4,100MPa 25,000 cP 175℃30min 32Ωcm