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  • 19th IC&Sensor Packaging Technology EXPO 2018 Announcement   NEW!

    December 27, 2017

    We will exhibit our products at  19th IC&Sensor Packaging Technology EXPO 2018.

    http://www.nepconjapan.jp/en/About/ICP/
    We are looking forward to seeing you.

     

    ■Outline

    Exhibition Period:Wednesday, January 17 – Friday, January 19, 2018, 10:00 a.m. to 6:00 p.m.(Last day until 17:00)

    Venue:East Exhibition Hall and Conference Tower, Tokyo Big Sight

    Address:3-21-1, Ariake, Koto-ku, Tokyo, 135-0063, Japan

    Booth:E26-4