Product

Unimec

Flip Chip Adhesive (SBB)

This thermoplastic conductive adhesive is used to supplement electrical connections between metallic bumps and mounting substrate electrodes in mounting technology involving direct electrical connections between the circuit on an IC chip, which has conductive bumps, and a mounting substrate.

Flip Chip Adhesive applications
Product
Number
Characteristics Applications Viscosity
[Pa・s]
Application
method
Curing
condition
Volume
resistivity
[Ω・cm]
Adhesive strength
[N/mm2]
H 9807 Low stress and
high reliability
SBB 20 Transferring 120℃, 120min. 0.7×10-4 0.4