Low Modulus Thermal Conductive Film for Metal Base Substrate
Key Features
Suitable for applications that require heat dissipation, such as power module, and automotive components. It has the capability of adhering on irregular surfaces because it becomes flexible when heated.
Property Data
| Product Number |
Characteristics | Thermal conductivity [W/m・K] |
Breakdown voltage [AC KV/mm] |
Solder heat resistance |
Thickness μm |
|---|---|---|---|---|---|
| TC1203 | Low thermal resistance | 3 | 60 | 260℃ | 50 |
| TC1211 | Low thermal resistance High heat resistance |
3 | 60 | 300℃ | 50 |
| TC1215 | High heat resistance Solder crack resistance |
2.5 | 60 | 300℃ | 110 |
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CONTACT
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