Product

ADFLEMA

Insulating adhesive film for sealing semiconductor components

This is a pre-applied non-conductive thin film adhesive. It is laminated to substrates or interposers and uses a thermal compression bonding process (TCB) to encapsulate IC chips on semiconductor packages. It has excellent productivity and can form a minimum fillet allowing a small Keep Out Zone (KOZ).
It can also be applied directly to silicon chips.

Insulating adhesive film for sealing semiconductor components