Product

ADFLEMA

High functionality insulating adhesive film for electronic parts and modules

This is an unreacted thermosetting resin film which provides high adhesion, high heat resistance and high reliability. This insulating thin film is available in thicknesses of 5-30µm. It has a low dielectric constant and a low dissipation factor in GHz frequency range. It has excellent fluidity which allows it to adapt to the concavity or convexity of surfaces under low temperature and low pressure. It is useful for reducing the size and lowering the profile of electronic components for RF modules.

High functionality insulating adhesive film for electronic parts and modules
Product
Number
Characteristics Film
Thickness
Cure
Condition
εr tanδ Cu peel
Strength
[N/cm]
Tg
[℃]
Elastic
Modulus
[GPa]
C.T.E.
α1
[ppm/℃]
Thermal
Resistance
(TG5%
decrease)
Insulating
Disruptive
Voltage
NC0201 High reliability (Low
water absorption,
high purity), High
adhesion strength
5-30,
50µm
200℃,
60min
1MPa
2.5 0.0025 11 185 0.8 130 370 Equivalent
with HB
NC0204 High Tg,Low elastic
modulus
High adhesion strength,
Low dielectric loss
25µm 200℃,
60min
1MPa
2.4 0.0030 7 235 0.3 130 350 Equivalent
with HB
NC0206 High reliability
(Low water absorption,
high purity)、
High adhesion strength
30µm 180℃,
60min
1MPa
2.5 0.0035 11 170 1.0 130 350 Equivalent
with HB
NC0207 High Tg, Low elastic
modulus
High adhesion strength,
Low dielectric loss
25µm 200℃,
60min
1MPa
2.4 0.0027 7 230 0.3 130 350 Equivalent
with HB