The NAMICS North American R&D Center - Diemat, Inc.@Profile

High thermal conductivity paste

Low modulus, High reliability

KEY FEATURES

  • Lower stress to die, Void-free bondlines
  • Reworkability at temperature as low as 150℃

APPLICATION

  • High reliability/Military
  • Multi-Chip Modulus or hybrids where reworkability is required
  • Plastic PGA, BGA, Chip-on-Board

DESCRIPTION

XH9940

  • High-power IC die attach

XH9941

  • IC, Sensor die attach

Typical properties

Product Number Thermal conductivity Modulus of elasticity Viscosity Curing condition Volume resistivity
XH9940 10 W/mK 4,100MPa 25,000 cP 175℃30min 32Ωcm
XH9941 10 W/mK 3,500MPa 20,000 cP 200℃30min 55Ωcm

High thermal conductivity, Automotives, High reliability

FEATURES

  • High thermal conductivity: 40-50W/mK
  • Extremely low moisture uptake-ideal for non-hermetic package
  • Void-free bondlines for maximum thermal transfer

APPLICATION

  • High thermal conductive, High-k thermal interface
  • High-power die attach
  • High-temperature wire bonding
  • Large area component attach

DESCRIPTION

Sk70N

  • Extended work time, Extremely low moisture uptake, high heat resistance, Suitable for military
  • High-power die attach, GaN

Typical properties

Product Number Thermal conductivity Modulus of elasticity Viscosity Curing condition Volume resistivity
Sk70N 50 W/mK 8,800MPa 30,000 cP 175℃60min 16Ωcm